Litcius/Paper detail

A modulus-engineered multi-layer polymer film with mechanical robustness for the application to highly deformable substrate platform in stretchable electronics

Youson Kim, Junmo Kim, Chan Young Kim, Taehyun Kim, Chungryeol Lee, Kihoon Jeong, Woosung Jo, Seunghyup Yoo, Taek‐Soo Kim, Kyung Cheol Choi, Sung Gap Im

2021Chemical Engineering Journal34 citationsDOI

Topics & Concepts

Materials sciencePolymer substrateFlexible electronicsUltimate tensile strengthComposite materialSubstrate (aquarium)ElectronicsStretchable electronicsModulusRobustness (evolution)Layer (electronics)ElastomerNanotechnologyOptoelectronicsElectrical engineeringEngineeringGeologyOceanographyChemistryBiochemistryGeneAdvanced Sensor and Energy Harvesting MaterialsConducting polymers and applicationsThin-Film Transistor Technologies