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Challenges in Minimizing Copper Dissolution for Lead Free Wave Soldering in Surface Mount Technology Going Towards Green Manufacturing

Mageswaran Arunasalam, Zulkiflle Leman, B. T. Hang Tuah B. Baharudin, Shamsuddin B. Sulaiman, Charles Santhakumar Anthony Das

2021International Journal of Precision Engineering and Manufacturing-Green Technology14 citationsDOI

Topics & Concepts

SolderingReworkWave solderingPrinted circuit boardSurface-mount technologyDissolutionMetallurgyMaterials scienceCopperEngineeringElectrical engineeringEmbedded systemChemical engineeringElectronic Packaging and Soldering TechnologiesAluminum Alloy Microstructure PropertiesAdvanced Welding Techniques Analysis
Challenges in Minimizing Copper Dissolution for Lead Free Wave Soldering in Surface Mount Technology Going Towards Green Manufacturing | Litcius