TEM and EBSD characterization revealing the recrystallization process occurring in the Sn-3.0Ag-0.5Cu Ball Grid Array solder joints during thermal cycling
Yihui Du, Yishu Wang, Xiaoliang Ji, Shihai Tan, Jing Han, Fu Guo
Topics & Concepts
Materials scienceElectron backscatter diffractionRecrystallization (geology)SolderingTemperature cyclingBall grid arrayDynamic recrystallizationMetallurgyComposite materialHot workingThermalMicrostructurePaleontologyMeteorologyPhysicsBiologyElectronic Packaging and Soldering TechnologiesMetallurgy and Material FormingAluminum Alloy Microstructure Properties