Bulk thermally conductive polyethylene as a thermal interface material
Gangchen Ren, Zhongtong Wang, Xinzhu Huang, Daniel Hur, M. A. Pfeifer, Meredith N. Silberstein, Zhiting Tian
Abstract
. We utilized wide-angle X-ray scattering to elucidate the molecular structural changes that led to this thermal conductivity enhancement. Furthermore, we conducted a device-cooling experiment and showed a 39% hot spot temperature reduction compared to a commercial ceramic-filled silicone thermal pad under a heating power of 3.6 W. Thus, this bulk-scale thermally conductive PE bar with nanoscale structural refinement demonstrated superior cooling performance, offering potential as an advanced thermal interface material for thermal management in microelectronics.
Topics & Concepts
Materials sciencePolyethyleneElectrical conductorComposite materialThermalInterface (matter)Electrically conductiveThermal greaseThermal conductivityCapillary numberPhysicsMeteorologyCapillary actionThermal properties of materialsComposite Material MechanicsThermal Radiation and Cooling Technologies