Fabrication and high-frequency characterization of low-cost fan-in/out WLP technology with RDL for 2.5D/3D heterogeneous integration
Ji Xu, Ying Sun, Jun Liu, Yi-Ding Wei, Wen‐Sheng Zhao, Da‐Wei Wang
Topics & Concepts
InterconnectionElectronic engineeringWaferWafer-level packagingMicrostripFabricationMaterials scienceEngineeringOptoelectronicsTelecommunicationsMedicinePathologyAlternative medicine3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesElectromagnetic Compatibility and Noise Suppression