Characterization of interfacial structure for low-temperature direct bonding of Si substrates sputtered with Ag nanotwinned films
Yu-Chang Lai, Po‐Ching Wu, Tung‐Han Chuang
Topics & Concepts
Materials scienceCharacterization (materials science)SputteringDirect bondingComposite materialMetallurgyCrystallographyNanotechnologyThin filmSiliconChemistry3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesCopper Interconnects and Reliability