Effects of the Ni electrodeposit on microstructure evolution and electrical resistance of the P-type Bi2Te3 solder joint
Jinxuan Cheng, Xiaowu Hu, Qinglin Li
Topics & Concepts
Materials scienceMicrostructureIntermetallicScanning electron microscopeDiffractometerMetallurgySolderingDiffusion barrierComposite materialAnalytical Chemistry (journal)AlloyLayer (electronics)ChemistryChromatographyAdvanced Thermoelectric Materials and DevicesElectronic Packaging and Soldering TechnologiesThermal properties of materials