Aging effect on high heat dissipation DBA and DBAC substrates for high power electronics
Guan‐Ren Chen, Kun‐Lin Lin, Chien-Cheng Lin
Topics & Concepts
Materials scienceIntermetallicIsothermal processOxideComposite materialThermal conductivitySubstrate (aquarium)CopperAluminiumThermal stabilityBrittlenessMetallurgyChemical engineeringAlloyThermodynamicsOceanographyEngineeringPhysicsGeologyAluminum Alloys Composites PropertiesAdvanced ceramic materials synthesisElectronic Packaging and Soldering Technologies