A systematic literature review: The effects of surface roughness on the wettability and formation of intermetallic compound layers in lead-free solder joints
Norliza Ismail, A. Atiqah, Azman Jalar, Maria Abu Bakar, R.A.A.A. Rahim, Ahmad Ghadafi Ismail, Aniza Hamzah, Lim Kar Keng
Topics & Concepts
SolderingWettingMaterials scienceIntermetallicLead (geology)Surface roughnessSurface finishMetallurgyLayer (electronics)Composite materialAlloyGeologyGeomorphologyElectronic Packaging and Soldering TechnologiesIntermetallics and Advanced Alloy PropertiesAluminum Alloys Composites Properties