Selective Laser Melting of Cu–10Sn–0.4P: Processing, Microstructure, Properties, and Brief Comparison with Additively Manufactured Cu–10Sn
R. Gu, Xiyu Yao, Dawei Wang, Hui Wang, Ming Yan, Kam Sing Wong
Abstract
Selective laser melting is an additive manufacturing technique that can be used to achieve excellent forming of Cu alloys. Specifically, high‐Sn–Cu alloys (e.g., Cu–10Sn) offer good wear and corrosion resistance, and are extensively used in industrial applications. Although P is considered a beneficial element in Cu–Sn alloys, particularly with respect to ductility, P‐doped Cu–10Sn alloy (Cu–10Sn–0.4P) has not yet been investigated in detail. Thus, herein, it provides valuable insights regarding the printability, residual stress level, heat treatment conditions, mechanical properties, and microstructural features of selective laser melted Cu–10Sn–0.4P. The alloy is successfully printed using a relatively wide range of processing parameters. The high levels of residual stress after printing were relieved using heat treatment under appropriate conditions. Consequently, a good combination of strength, ductility, and hardness was achieved. The addition of P led to an improved oxygen scavenging capability, thus Cu–10Sn–0.4P alloy exhibited a better ductility than P‐free Cu–Sn alloy. The excellent printability of Cu–10Sn–0.4P is demonstrated by printing a variety of objects, including flanges, sheathings, and jewelry rings.