Wafer-to-wafer hybrid bonding at 400-nm interconnect pitch
Soon Aik Chew, Joeri De Vos, Eric Beyne
Topics & Concepts
WaferInterconnectionWafer bondingMaterials scienceOptoelectronicsDie preparationComputer scienceTelecommunicationsWafer dicing3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesNanofabrication and Lithography Techniques