Bidirectional interlayer cooling of 3D chip stack for temperature uniformity enhancement and hotspot mitigation
Xiu Li, Yimin Xuan
Topics & Concepts
Hotspot (geology)Materials scienceChipStack (abstract data type)Three-dimensional integrated circuitOptoelectronicsEngineering physicsEnvironmental scienceNuclear engineeringElectrical engineeringEngineeringGeologyComputer scienceIntegrated circuitGeophysicsProgramming languageHeat Transfer and Optimization3D IC and TSV technologiesThermal properties of materials