Fatigue crack growth behavior of TA15/TC4 dissimilar laminates fabricated by diffusion bonding
Tianle Li, Huiping Wu, Bin Wang, Sheng Li, Xifeng Li, Jun Chen
Topics & Concepts
Materials scienceEquiaxed crystalsComposite materialParis' lawDiffusion bondingMicrostructureElectron backscatter diffractionCrack closureAlloyRecrystallization (geology)Ultimate tensile strengthFracture mechanicsGeologyPaleontologyAdvanced Welding Techniques AnalysisTitanium Alloys Microstructure and PropertiesAluminum Alloy Microstructure Properties