Litcius/Paper detail

Effect of micromorphology on corrosion and mechanical properties of SAC305 lead-free solders

Gang Chen, X.H. Wang, Jian Yang, Weixing Xu, Qiang Lin

2020Microelectronics Reliability33 citationsDOI

Topics & Concepts

CorrosionMaterials scienceMetallurgySolderingAlloyPolarization (electrochemistry)Composite materialChemistryPhysical chemistryElectronic Packaging and Soldering TechnologiesAluminum Alloy Microstructure PropertiesIntermetallics and Advanced Alloy Properties
Effect of micromorphology on corrosion and mechanical properties of SAC305 lead-free solders | Litcius