Litcius/Paper detail

Embedded microfluidic cooling with compact double H type manifold microchannels for large-area high-power chips

Yu‐Chi Yang, Jianyu Du, Motong Li, Weihao Li, Qi Wang, Bo Wen, Chi Zhang, Yufeng Jin, Wei Wang

2022International Journal of Heat and Mass Transfer84 citationsDOI

Topics & Concepts

Materials scienceReynolds numberMicrofluidicsNusselt numberWaferThermal resistanceSiliconChipDissipationMechanicsOptoelectronicsThermodynamicsHeat transferNanotechnologyElectrical engineeringTurbulenceEngineeringPhysicsHeat Transfer and OptimizationHeat Transfer MechanismsHeat Transfer and Boiling Studies
Embedded microfluidic cooling with compact double H type manifold microchannels for large-area high-power chips | Litcius