Nanoindentation Response of Monocrystalline Copper via Molecular Dynamics: Anisotropic Edge Effects
Desong Du, Peng Wu, Huan Liu, Zhengkun Li, Jiubin Tan
Abstract
In the nanoindentation testing of metallic materials, mechanical properties often decrease significantly when the indentation position shifts from the central region to the edge due to edge effects, leading to premature edge failure and potential device malfunctions. In this work, molecular dynamic (MD) simulations were conducted to investigate the anisotropic edge effects of nanoindentation on monocrystalline copper with a specific crystal orientation. The results reveal that changes in indentation position strongly influence surface collapse and lateral pile-up behaviors. Notably, edge positions resulted in significant reductions in indentation force and hardness, accompanied by pronounced anisotropy in nanoindentation hardness. Additionally, distinct von Mises stress distributions were observed at different indentation positions, highlighting the crystallographic orientation's role in modulating edge effects. This study provides new insights into the atomic-scale mechanisms underlying edge effects in metallic materials and their anisotropic characteristics.