Cu─X Bonds Regulated Conduction and Polarization Loss in Conductive Metal‐Organic Framework Under Electromagnetic Field
Siyao Cheng, Qinglin Zhou, Daohu Sheng, Wei Dong, Jin‐Hu Dou, Yuan‐Biao Huang, Rong Cao, Aming Xie, Roland A. Fischer, Soumya Mukherjee, Weijin Li
Abstract
Abstract Conduction and polarization are known to profoundly impact conductive metal–organic frameworks (c‐MOFs) for their applications in electromagnetic wave (EMW) absorption. Albeit a few advances along c‐MOF platforms in enhancing their EMW absorption performances, reticular modulation‐led inter/intra‐layer conduction and polarization loss remains an unmet challenge. To address this, a ligand substitution‐guided bottom‐up structural control strategy is introduced to study the depth of reticular modulation‐led inter/intra‐layer conduction and polarization loss in c‐MOFs under an electromagnetic (EM) field. A family of triphenylene‐X ligands (X = −NH 2 , −OH, and −SH) is harnessed to afford an isoreticular family of three Cu‐based c‐MOFs. Thanks to the distinct Cu─X bonds, such a platform allowed to systematically study the synergistic features of conduction and polarization loss in EMW absorption enhancement. One of the trio, Cu 3 (HITP) 2 (X = −NH 2 ; HITP, 2,3,6,7,10,11‐hexahydroxytriphenylene) is identified with an optimal EM loss capacity under the EM field, achieving a record‐high reflection loss of −63.03 dB in the effective absorption range of 3–18 GHz band. Setting up a new benchmark for EM loss among c‐MOFs, this study introduces a way to leverage control in the charge mobility characteristics of Cu─X bonds relative to the dielectric losses at both molecular and atomic scales.