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Microfluidic silicon interposer for thermal management of GaN device integration

Miao Yu, Hao Zhang, Min Huang, Hongze Zhang, Jian Zhu

2023Applied Thermal Engineering12 citationsDOI

Topics & Concepts

Materials scienceMicrochannelOptoelectronicsMicroelectronicsMiniaturizationThermal resistanceSiliconInterposerMicrosystemMicrofluidicsChipWater coolingHeat transferMechanical engineeringNanotechnologyElectrical engineeringMechanicsEngineeringPhysicsEtching (microfabrication)Layer (electronics)Heat Transfer and OptimizationHeat Transfer and Boiling StudiesHeat Transfer Mechanisms
Microfluidic silicon interposer for thermal management of GaN device integration | Litcius