Thermal design and management of micro-pin fin heat sinks for energy-efficient three-dimensional stacked integrated circuits
Daewoong Jung, Haeun Lee, Haeun Lee, Daeyoung Kong, Eunho Cho, Ki Wook Jung, Chirag R. Kharangate, Madhusudan Iyengar, Chris Malone, Mehdi Asheghi, Kenneth E. Goodson, Hyoungsoon Lee, Hyoungsoon Lee
Topics & Concepts
Materials scienceHeat sinkHeat transferPressure dropFinElectronics coolingWaferReynolds numberHeat fluxOptoelectronicsComposite materialMechanical engineeringMechanicsPhysicsTurbulenceEngineeringHeat Transfer and OptimizationHeat Transfer MechanismsHeat Transfer and Boiling Studies