A fundamental study of improving thermal interface connection by using silane modified, in-situ formed silver-graphene fillers in epoxy polymers for future semiconductor device packaging
Zhijian Sun, Ryan Wong, Yifan Liu, Michael Yu, Jiaxiong Li, Huilong Liu, Dong An, Macleary Moran, Ahmet Mete Muslu, Ching‐Ping Wong
Topics & Concepts
Materials scienceGrapheneEpoxyThermal conductivityComposite materialPolymer nanocompositeNanocompositeSemiconductorPolymerThermal greaseNanotechnologyOptoelectronicsThermal properties of materialsGraphene research and applicationsTribology and Wear Analysis