Micrometer-scale composite pin-fin diamond microchannel heat sink for near-10-kilowatt-level chip thermal management
Ci Ao, Nan Zhou, Bo Xu, Zhenqian Chen
Topics & Concepts
Heat sinkDiamondComposite numberMaterials scienceMicrochannelFinThermal management of electronic devices and systemsChipHeat spreaderMicrometerThermalComposite materialMechanical engineeringOptoelectronicsNanotechnologyElectrical engineeringEngineeringThermodynamicsPhysicsHeat Transfer and OptimizationHeat Transfer and Boiling StudiesHeat Transfer Mechanisms