Mechanical behavior of polycrystals: Coupled in situ DIC-EBSD analysis of pure copper under tensile test
Jean‐Patrick Goulmy, Dorian Depriester, Fabrice Guittonneau, Laurent Barrallier, Simon Jégou
Topics & Concepts
Digital image correlationMaterials scienceElectron backscatter diffractionUltimate tensile strengthTensile testingMicrostructureCrystalliteComposite materialScanning electron microscopeCopperScale (ratio)MetallurgyPhysicsQuantum mechanicsMicrostructure and mechanical propertiesNon-Destructive Testing TechniquesMetallurgy and Material Forming