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Nucleation and growth of Cu6Sn5 during the aging process of Cu/Sn interface in electronic packaging-by in-situ TEM

Jintao Wang, Ziwen Lv, Luobin Zhang, Fangcheng Duan, Jianqiang Wang, Fuquan Li, Hongtao Chen, Mingyu Li

2023Acta Materialia38 citationsDOI

Topics & Concepts

NucleationMaterials scienceCrystallographyChemical physicsSolderingGrain boundaryDiffusionGrain growthHillockMetallurgyComposite materialThermodynamicsMicrostructureChemistryPhysicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis
Nucleation and growth of Cu6Sn5 during the aging process of Cu/Sn interface in electronic packaging-by in-situ TEM | Litcius