Encapsulated solid-liquid dual continuous pathways with low modulus and high thermal conductivity for dynamic target autonomous thermal management
Qingxia He, Mengmeng Qin, Heng Zhang, Shuo Wang, Wei Feng
Topics & Concepts
Thermal conductivityDual (grammatical number)Materials scienceThermalModulusComposite materialThermodynamicsPhysicsLiteratureArtThermal properties of materialsHeat Transfer and OptimizationHeat Transfer and Boiling Studies