Wearable thermoelectric cooler encapsulated with low thermal conductivity filler and honeycomb structure for high cooling effect
Yangfan Gao, Sijing Zhu, Jie Gao, Lei Miao, Fen Xu, Lixian Sun
Topics & Concepts
Materials scienceThermal conductivityThermoelectric effectHoneycombFiller (materials)Composite materialThermoelectric coolingWearable computerThermalHoneycomb structureThermal management of electronic devices and systemsOptoelectronicsMechanical engineeringMeteorologyThermodynamicsEmbedded systemPhysicsEngineeringComputer scienceThermal Radiation and Cooling TechnologiesAdvanced Thermoelectric Materials and DevicesBuilding Energy and Comfort Optimization