Volumetric nondestructive metrology for 3D semiconductor packaging: A review
Yutai Su, Jing Shi, Yuan-Ming Hsu, Dai-Yan Ji, Alex Suer, Jay Lee
Topics & Concepts
Nondestructive testingMetrologyIntegrated circuit packagingReliability (semiconductor)Packaging engineeringIntegrated circuitReliability engineeringEngineeringComputer scienceSystems engineeringEngineering drawingMechanical engineeringElectrical engineeringStatisticsMathematicsPower (physics)RadiologyPhysicsQuantum mechanicsMedicineIntegrated Circuits and Semiconductor Failure AnalysisNear-Field Optical MicroscopyMicrowave and Dielectric Measurement Techniques