Mean-Time-To-Failure Equations for Electromigration, Thermomigration, and Stress Migration
K. N. Tu, Andrij Gusak
Abstract
The equation of mean-time-to-failure (MTTF) for electromigration has been reevaluated from the viewpoint that in irreversible processes, entropy production is the controlling factor. We have justified that the power factor on current density is n = 2 , as given in Black's equation. Furthermore, on the basis of entropy production, we provide a unified model of the equations of MTTF for thermomigration and stress migration. The effect of thermal conduction on the physical link between entropy production and the failure of void formation is discussed.
Topics & Concepts
ElectromigrationMean time between failuresVoid (composites)Entropy productionCurrent densityEntropy (arrow of time)Materials scienceThermodynamicsStatistical physicsMathematicsPhysicsFailure rateStatisticsComposite materialQuantum mechanicsCopper Interconnects and ReliabilityElectronic Packaging and Soldering TechnologiesNanofabrication and Lithography Techniques