Ruptured liquid metal microcapsules enabling hybridized silver nanowire networks towards high-performance deformable transparent conductors
Shipeng Wang, Huaisen Tian, Yawen Wang, Haojie Zuo, Chengliang Tao, Jiawei Liu, Pengyuan Li, Yan Yang, Xu Kou, Jiangxin Wang, Wenbin Kang
Abstract
Extensive studies have been carried out on silver nanowires (AgNWs) in view of their impressive conductivity and highly flexible one-dimensional structure. They are seen as a promising choice for producing deformable transparent conductors. Nonetheless, the widespread adoption of AgNW-based transparent conductors is hindered by critical challenges represented by the significant contact resistance at the nanowire junctions and inadequate interfacial adhesion between the nanowires and the substrate. This study presents a novel solution to tackle the aforementioned challenges by capitalizing on liquid metal microcapsules (LMMs). Upon exposure to acid vapor, the encapsulated LMMs rupture, releasing the fluid LM which then forms a metallic overlay and hybridizes with the underlying Ag network. As a result, a transparent conductive film with greatly enhanced electrical and mechanical properties was obtained. The transparent conductor displays negligible resistance variation even after undergoing chemical stability, adhesion, and bending tests, and ultrasonic treatment. This indicates its outstanding adhesion strength to the substrate and mechanical flexibility. The exceptional electrical properties and robust mechanical stability of the transparent conductor position it as an ideal choice for direct integration into flexible touch panels and wearable strain sensors, as evidenced in this study. By resolving the critical challenges in this field, the proposed strategy establishes a compelling roadmap to navigate the development of high-performance AgNW-based transparent conductors, setting a solid foundation for further advancement in the field of deformable electronics.