Organosoluble thermoplastic polyimide with improved thermal stability and UV absorption for temporary bonding and debonding in ultra-thin chip package
Jinshan Liu, Jinhui Li, Tao Wang, Dongxu Huang, Zhipeng Li, Ao Zhong, Wen Liu, Yuying Sui, Qiang Liu, Fangfang Niu, Guoping Zhang, Rong Sun
Topics & Concepts
PolyimideMaterials scienceThermoplasticUltimate tensile strengthComposite materialThermal stabilityWaferThin filmGlass transitionAdhesionPolymerLayer (electronics)OptoelectronicsChemical engineeringNanotechnologyEngineeringSynthesis and properties of polymersAdvanced Sensor and Energy Harvesting MaterialsDielectric materials and actuators