Hydrogel-based bimodal sensor array via modular assembly with decoupled strain–temperature sensing and high sensitivity
Fei Wang, Xiaojing Wu, Wenao Liao, Ting Li, Yidan Hu, Yan Zhu, Chang Lu, Junwei Feng, Xilin Liu
Topics & Concepts
Gauge factorMaterials scienceDecoupling (probability)Modular designPiezoresistive effectSensitivity (control systems)OptoelectronicsStrain gaugeSIGNAL (programming language)Microscale chemistryInterface (matter)Sensor arrayWearable computerRigidity (electromagnetism)NanotechnologyElectronic engineeringWearable technologyComputer scienceThermoelectric effectCoatingTemperature measurementElectronicsSilicon on insulatorChipFabricationRobustness (evolution)Seebeck coefficientThermalAcousticsAdvanced Sensor and Energy Harvesting MaterialsModular Robots and Swarm IntelligenceAdvanced Materials and Mechanics