Multi-chip Jet impingement cooling for heat dissipation in 2.5D integrated system with 1 kW+ thermal design power
Akshat Patel, Ketan Yogi, Gopinath Sahu, Tiwei Wei
Topics & Concepts
Thermal management of electronic devices and systemsMaterials scienceDissipationJet (fluid)ChipWater coolingPower (physics)ThermalNuclear engineeringMechanicsMechanical engineeringThermodynamicsComputer sciencePhysicsTelecommunicationsEngineeringHeat Transfer MechanismsHeat Transfer and OptimizationTribology and Lubrication Engineering