Recrystallization and Grain Growth in Cu-Cu Joints under Electromigration at Low Temperatures
Shih‐Chi Yang, Dinh-Phuc Tran, Chih Chen
Abstract
The behavior of recrystallization and grain growth was examined in Cu-Cu joints during electromigration at 150 °C. Recrystallization and grain growth were observed in all the joints after electromigration for 9000 h. Voiding was formed in Cu current-feeding lines and in bonding interfaces, and resistance increased with time due to the void formation. However, instead of rising abruptly, the resistance of certain Cu joints dropped after 7000 h. Microstructural analysis revealed that a large grain growth occurred in these joints at 150 °C, and the bonding interface was eliminated. Therefore, the electromigration lifetime can be prolonged for these joints.
Topics & Concepts
ElectromigrationRecrystallization (geology)Materials scienceVoid (composites)Grain growthMetallurgyGrain sizeCopperComposite materialGeologyPaleontologyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesCopper Interconnects and Reliability