Toward Advancing 3D-ICs Physical Design: Challenges and Opportunities
Xueyan Zhao, Weiguo Li, Zhisheng Zeng, Zhipeng Huang, Biwei Xie, Xingquan Li, Yungang Bao
Abstract
As the demand for higher integration density and performance efficiency continues to grow, 3D stacking has emerged as a promising solution. In 3D ICs, the complexity of physical design and the optimization space is significantly increasing. Therefore, researching high-quality 3D native instead of pesudo 3D physical design has become even more important. This paper reviews recent advancements and persistent challenges in 3D physical design, focusing on F2F bonding technologies. Then, this paper discusses several issues that still require further research and some overlooked problems, with the hope of helping researchers develop higher-quality 3D native physical design tools in the future.