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Superior strength and strengthening mechanism of die attachment joints by using bimodal-sized Cu nanoparticle paste capable of low-temperature pressureless sintering

Hui Huang, Xin Wu, M. B. Zhou, Xin‐Ping Zhang

2021Journal of Materials Science Materials in Electronics21 citationsDOI

Topics & Concepts

Materials scienceSinteringNanoparticlePressureless sinteringFabricationDie (integrated circuit)MicrostructureShear strength (soil)Phase (matter)Composite materialNanotechnologyAlternative medicineChemistryMedicineEnvironmental scienceSoil waterOrganic chemistrySoil sciencePathologyElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites Properties3D IC and TSV technologies
Superior strength and strengthening mechanism of die attachment joints by using bimodal-sized Cu nanoparticle paste capable of low-temperature pressureless sintering | Litcius