Investigation of the effect of different cleaning forces on Ce-O-Si bonding during oxide post-CMP cleaning
Samrina Sahir, Nagendra Prasad Yerriboina, So-Young Han, Kwang-Min Han, Tae‐Gon Kim, Niraj Mahadev, Jin-Goo Park
Topics & Concepts
Data scrubbingChemical-mechanical planarizationDissolutionOxidePolishingChemical engineeringSulfuric acidMaterials scienceHydrogen peroxideChemical bondWet cleaningChemistryInorganic chemistryMetallurgyWaste managementOrganic chemistryEngineeringAdvanced Surface Polishing TechniquesSemiconductor materials and devicesDiamond and Carbon-based Materials Research