Material removal rate of double-faced mechanical polishing of 4H-SiC substrate
Peng Zhang, Jingfang Yang, Huadong Qiu
Topics & Concepts
PolishingSilicon carbideMaterials scienceSubstrate (aquarium)Surface roughnessDie (integrated circuit)GrindingChemical-mechanical planarizationSurface finishRADIUSSemiconductorSemiconductor device fabricationMechanical engineeringOptoelectronicsComposite materialComputer scienceNanotechnologyEngineeringWaferOceanographyComputer securityGeologyAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationAluminum Alloys Composites Properties