Influence of interfacial structure on bonding strength and thermoelectric transport properties of Cu6Sn5/Cu interface
Zhihang Zhang, Qiuguo Yang, Jihua Huang, Shuhai Chen, Zheng Ye, Jian Yang
Topics & Concepts
Materials scienceIonic bondingThermal conductivityChemical bondCovalent bondElectrical resistivity and conductivityConductivityCopperCondensed matter physicsComposite materialPhysical chemistryMetallurgyIonChemistryElectrical engineeringPhysicsOrganic chemistryEngineeringAdvanced Thermoelectric Materials and DevicesThermal properties of materialsElectronic Packaging and Soldering Technologies