Understanding interfacial compounds induced by Ag diffusion on improving interface electrical contact resistivity between the Cu electrode and Bi2Te3 thin film
Zeyu Liu, Zeyu Liu, Limei Shen, Junhao Yan, Zun Liu, Zun Liu, Zhichun Liu, Zhichun Liu
Topics & Concepts
Electrical resistivity and conductivityElectrodeMaterials scienceDiffusionThin filmElectrical contactsComposite materialNanotechnologyChemistryElectrical engineeringPhysical chemistryThermodynamicsEngineeringPhysicsAdvanced Thermoelectric Materials and DevicesElectronic Packaging and Soldering TechnologiesSurface and Thin Film Phenomena