Fundamentals of DSC
Joseph D. Menczel, Remi Andre, William S. Kohl, Vadim V. Krongauz, Dénes Lôrinczy, Michael Reading, Janusz Grȩbowicz
Topics & Concepts
Materials scienceComputer scienceThermal properties of materialsElectronic Packaging and Soldering TechnologiesMaterial Dynamics and Properties