Effects of bismuth and nickel on the microstructure evolution of Sn-Ag-Cu (SAC)-based solders
Preeth Sivakumar, Kathy O’Donnell, Junghyun Cho
Topics & Concepts
Materials scienceIntermetallicSolderingMicrostructureMetallurgyIndentation hardnessSofteningAlloyComposite materialElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis