Interfacial transformation of preoxidized Cu microparticles in a formic-acid atmosphere for pressureless Cu–Cu bonding
Runhua Gao, Siliang He, Jiahui Li, Yu-An Shen, Hiroshi Nishikawa
Topics & Concepts
Materials scienceFormic acidSinteringChemical engineeringOxideDegradation (telecommunications)Temperature cyclingMicrostructureAtmosphere (unit)Accumulative roll bondingMetallurgyThermalChemistryOrganic chemistryElectronic engineeringEngineeringPhysicsMeteorologyThermodynamics3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesAdvanced ceramic materials synthesis