Simultaneously enhancing mechanical properties and electrical conductivity of Cu-0.5%Cr alloy as 5G connector material
Zhu Qi Chu, Kun Wei, Wei Wei, Igor Alexandrov, Xu Long An, Dan Wang, Xiang Kui Liu
Topics & Concepts
Materials scienceAlloyMicrostructureElectrical resistivity and conductivityIndentation hardnessComposite materialDislocationPrecipitationLamellar structureMetallurgyGrain boundaryDeformation (meteorology)Phase (matter)ConductivityElectrical engineeringPhysical chemistryMeteorologyPhysicsEngineeringChemistryOrganic chemistryMicrostructure and mechanical propertiesAluminum Alloys Composites PropertiesAluminum Alloy Microstructure Properties