Effect of small-sized modifier on boron nitride for efficient heat transfer through thermal conductive epoxy composites
Dong‐In Shin, Jisung Lee, Mi Ri Kim, Sooyeol Jeong, Ji-In Park, Sangyul Baik, Gi‐Ra Yi, Seung‐Young Park, Gaehang Lee
Abstract
Surface modification of a crystalline filler is a powerful method for increasing the thermal conductivity (κ) of filler-impregnated composites. Herein, boron nitride (BN) filler was functionalized with cationic molecules of different sizes to directly recognize the effect of an amorphous area on the filler-polymer matrix interface. Measured thermal conductivity and temperature rise for a polymer composite was up to 67.1 % and 15.3 % greater, respectively, in the sample to which the smallest molecule-modified BN was added, compared to the comparable sample with free BN. The smaller the size of the modifier molecule, the better it bonds with the resin and the smaller the non-crystalline area. Such changes improve the heat transfer at the interface by reducing interfacial thermal resistance. These findings can serve as a reference to develop alternative and effective strategies for filler modification, an alternative approach instead of focusing on functional groups and modifiers.