Litcius/Paper detail

N-Polar Deep Recess GaN HEMT With a TiN Schottky Gate Contact Demonstrating 53.4% PAE and 3.7 W/mm Associated P<sub>out</sub> at 94 GHz

Henry Collins, Emre Akso, Christopher J. Clymore, Kamruzzaman Khan, Robert Hamwey, Nirupam Hatui, Matthew Guidry, S. Keller, Umesh K. Mishra

2024IEEE Microwave and Wireless Technology Letters18 citationsDOI

Abstract

A stack of TiN/Ru was employed as the Schottky gate metal for a nitrogen-polar deep-recess GaN high electron mobility transistor (HEMT) on a sapphire substrate. TiN/Ru Schottky diodes fabricated on the same HEMT epitaxy demonstrated a 6 <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\times$</tex-math> </inline-formula> reduction in reverse-bias leakage current compared to Ru-only counterparts. The addition of TiN also resulted in a clear improvement in breakdown voltage for scaled N-polar Schottky gate HEMTs, as measured by the drain-current injection method (DCI). TiN HEMTs exhibited a peak <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\textit{g}_{\text{\textit{m},dc}}$</tex-math> </inline-formula> of 843 mS/mm. A HEMT with a gate length ( <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$L_{\text{\textit{g}}}$</tex-math> </inline-formula> ) of 50 nm demonstrated a peak <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\textit{g}_{\text{\textit{m},RF}}$</tex-math> </inline-formula> of 1028 mS/mm, peak <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$f_{t}$</tex-math> </inline-formula> of 193 GHz, and peak <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$f_{\max}$</tex-math> </inline-formula> of 362 GHz. Load–pull was measured at 94 GHz with a <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$V_{\text{DS}}$</tex-math> </inline-formula> of 12 V and <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$I_{\text{DS}}$</tex-math> </inline-formula> of 250 mA/mm. The TiN HEMT demonstrated a power added efficiency (PAE) of 53.4%—a record for N-polar GaN at <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$W$</tex-math> </inline-formula> -band. The associated output power density was 3.7 W/mm, and the linear power gain (G <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$_{\text{\textit{p}}}$</tex-math> </inline-formula> ) was an exceptional 10.2 dB.

Topics & Concepts

High-electron-mobility transistorSchottky barrierTinMaterials scienceOptoelectronicsSchottky diodePolarElectrical engineeringPhysicsEngineeringTransistorMetallurgyVoltageAstronomyDiodeGaN-based semiconductor devices and materialsAdvancements in Semiconductor Devices and Circuit DesignRadio Frequency Integrated Circuit Design