Enhanced thermal conductivity of copper/diamond composites by fine-regulating microstructure of interfacial tungsten buffer layer
Jianquan Sang, Lingping Zhou, Wulin Yang, Jiajun Zhu, Licai Fu, Deyi Li
Topics & Concepts
MicrostructureMaterials scienceDiamondComposite materialThermal conductivityTungsten carbideTungstenComposite numberCoatingAnnealing (glass)Layer (electronics)CarbideMetallurgyAluminum Alloys Composites PropertiesAdvanced ceramic materials synthesisThermal properties of materials