Self-healing silicon-containing eugenol-based epoxy resin based on disulfide bond exchange: Synthesis and structure-property relationships
Wenbin Li, Laihui Xiao, Yigang Wang, Jie Chen, Xiaoan Nie
Topics & Concepts
EpoxyThermosetting polymerDiglycidyl etherMaterials scienceMonomerEugenolPolymerUltimate tensile strengthBond strengthComposite materialPolymer chemistryChemistryBisphenol AOrganic chemistryAdhesiveLayer (electronics)Polymer composites and self-healingEpoxy Resin Curing ProcessesPhotopolymerization techniques and applications