3D Printable, form stable, flexible phase-change-based electronic packaging materials for thermal management
Chang‐Ping Feng, Kai-Yin Sun, Jin‐Chao Ji, Lei Hou, Gong‐Peng Cui, Zhongguo Zhao, Hongbo Lan
Topics & Concepts
Materials scienceMicroelectronicsElectronicsElectronic packagingPhase-change materialFlexible electronicsComposite materialPhase (matter)NanotechnologyPhase changeEngineering physicsElectrical engineeringOrganic chemistryEngineeringChemistryPhase Change Materials ResearchAdvanced Thermoelectric Materials and DevicesThermal properties of materials