Interfacial bonding mechanisms in ultrasonic-assisted soldered Si/Cu joint using Sn-3.5Ag-4Al solder
Wenzhao Li, Zhijie Ding, Haitao Xue, Weibing Guo, Cuixin Chen, Yang Jia, Zheng Wan
Topics & Concepts
Materials scienceSolderingComposite materialBrittlenessMicrostructureUltrasonic sensorJoint (building)CeramicLayer (electronics)MetallurgyEngineeringArchitectural engineeringPhysicsAcousticsElectronic Packaging and Soldering TechnologiesAdvanced Welding Techniques AnalysisAdvanced ceramic materials synthesis