Litcius/Paper detail

Shape-stabilized low melting-point alloy/expanded graphite composite thermal pad with excellent chip heat dissipation performance

Yu Zhao, Zhengguo Zhang, Ziye Ling, Xuenong Gao, Xiaoming Fang

2022Applied Thermal Engineering16 citationsDOI

Topics & Concepts

Materials scienceThermal conductivityGraphiteComposite materialAlloyComposite numberMelting pointThermal greaseThermal properties of materialsHeat Transfer and OptimizationAerogels and thermal insulation
Shape-stabilized low melting-point alloy/expanded graphite composite thermal pad with excellent chip heat dissipation performance | Litcius