In-situ characterization of thermomechanical behavior of copper nano-interconnect for 3D integration
B. Ayoub, S. Moreau, S. Lhostis, H. Frémont, Sébastien Mermoz, Emeline Souchier, E. Deloffre, S. Escoubas, Thomas W. Cornelius, Ο. Thomas
Topics & Concepts
Materials scienceInterconnectionComposite materialAnisotropyNanocrystalline materialSynchrotronCopperNanotechnologyMetallurgyOpticsComputer sciencePhysicsComputer networkAluminum Alloys Composites Properties3D IC and TSV technologiesMicrostructure and mechanical properties